An electronic assembly for a transmission control module includes a printed circuit board and a heat sink. The circuit board includes a first side, a second side averted from the first side, and at least one heat-generating component arranged on the first side and covered with at least one flowable and curable protective compound. The heat sink has an inner face facing the second side and is, at least in sections, spaced apart from the circuit board by at least one gap. The gap is at least partially filled with the at least one flowable and curable protective compound such that the flowable and curable protective compound is in direct contact with the circuit board and the heat sink. The heat sink adheres to the protective compound in a cohesive manner when the flowable and curable protective compound is in the cured state.