The invention discloses selective copper corrosive liquid. The selective copper corrosive liquid comprises, by weight percent, 1%-20% of an oxidizing agent, 0.001%-5% of a hydrogen peroxide stabilizer, 0.01%-10% of inorganic acid, 1%-4% of soluble organic acid divalent copper salt, 0.01%-8% of a chelating agent and/or corrosion inhibitor, 0.001%-3% of a surface active agent and the balance water.The oxidizing agent is mainly composed of hydrogen peroxide. The inorganic acid and the soluble organic acid divalent copper salt are added in the corrosive liquid at the same time, the pre-reaction of copper dissolving through the corrosive liquid is accelerated, uniform etching can be better achieved, and a controllable electrode shape is obtained. The invention further discloses application ofthe selective copper corrosive liquid to corrode copper or a copper compound layer on a semi-conductive wafer.