Provided is a production method for a copper-clad laminate plate wherein a copper foil and a resin are bonded with high adhesive force despite the use of a thermoplastic resin that has a low dielectric constant. This method includes: a step for preparing a roughened copper foil that has, on at least one side thereof, a roughened surface that comprises fine recesses and protrusions that are configured from acicular crystals that include cupric oxide and cuprous oxide; and a step for sticking a sheet of thermoplastic resin to the roughened surface of the roughened copper foil to obtain a copper-clad laminate plate. The method is characterized in that, at the point in time at which the thermoplastic resin is stuck thereto, the roughened surface has a cupric oxide thickness, as determined by sequential electrochemical reduction analysis (SERA), of 1-20 nm and a cuprous oxide thickness, as determined by sequential electrochemical reduction analysis (SERA), of 15-70 nm.