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CN107750402B 发光二极管和用于制造发光二极管的方法 有权

发光二极管和用于制造发光二极管的方法
摘要：
提出一种发光二极管(100)，所述发光二极管具有光电子半导体芯片(1)，所述光电子半导体芯片具有辐射侧(16)、与辐射侧(16)相对置的接触侧(12)和横向于辐射侧(16)伸展的侧面(15)。在接触侧(12)上安置有用于外部电接触半导体芯片(1)的第一接触元件(10)。此外，发光二极管(100)包括透明的实心体(2)以及覆盖元件(3)。在正常运行中，半导体芯片(1)经由辐射侧(16)沿着横向于辐射侧(16)伸展的主发射方向(17)发射电磁辐射。在此，半导体芯片(1)嵌入到实心体(2)中，其中侧面(15)和辐射侧(16)由实心体(2)形状配合地覆盖。实心体(2)沿着主发射方向(17)扩宽。覆盖元件(3)沿主发射方向(17)设置在实心体(2)的下游，并且直接地施加到实心体(2)上。覆盖元件(3)的背离实心体(2)的一侧构成为发光二极管(100)的辐射出射面(30)。第一接触元件(10)在发光二极管(100)的未安装和/或未接触的状态下露出。
摘要（英）：

A light-emitting diode includes an optoelectronic semiconductor chip that emits electromagnetic radiation through a radiation side along a main direction of emission running transversely to the radiation side during operation, the semiconductor chip is embedded in a solid body, wherein side surfaces and the radiation side are covered by the solid body in a form-fit manner, the solid body widens along the main direction of emission, a cover element is arranged downstream of the solid body in the main direction of emission and is applied directly onto the solid body, a side of a cover element facing away from the solid body is formed as a radiation exit surface of the light-emitting diode, and a first contact element is exposed in an unmounted and/or non-contacted state of the light-emitting diode.

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