The invention belongs to the technical field of circuit boards and particularly relates to a multi-layer printed circuit board mechanism. The multi-layer printed circuit board mechanism comprises multiple layers of printed circuit boards, wherein the multiple layers of printed circuit boards include a plurality of printed circuit boards, multiple printed circuit boards are laminated and connected,each printed circuit board comprises metal foil wires and a metal-foil-coated laminated board, the metal foil wires are spirally and fixedly arranged on the metal-foil-coated laminated board in an annular surrounding mode, and a plurality of printed circuit boards are connected through circuits. The multiple layers of printed circuit boards of the multi-layer printed circuit board mechanism serveas a module, the module and a frame are bonded together, the multi-layer printed circuit board mechanism is convenient and simple and facilitates organization and production, and the labor cost is reduced. The copper-foil-coated laminated board are coated with copper foils, the copper foils are dipped with resin and form a whole with the laminated boards, a starting-end connector and a tail-end connector are located on the laminated boards, multiple layers of laminated boards are compressed together, and the size is small.