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发明公开
CN107825005A 一种低温焊锡膏及其制备方法 无效 - 驳回

一种低温焊锡膏及其制备方法
摘要：
一种低温焊锡膏及其制备方法，所述焊锡膏由SnBiAgSb-X合金粉和助焊膏组成，其中X是Ge、In、Co、Ni、P中的一种或几种；SnBiAgSb-X合金粉和助焊膏的重量比为87-90：10-13；所述助焊膏的组分及质量百分比为：25-35％的树脂H130、10-20％的树脂AX-80、0.5-2％的IRG245抗氧剂、3-5％的BHT抗氧剂、5-7％的触变剂、8-13％的活性剂、30-45％的溶剂。本发明的焊锡膏应用于电子产品焊接中，可降低焊接温度，提高焊接可靠性，并有效解决焊点周边有黑圈及焊盘锡珠过多的问题。
摘要（英）：

Provided is low-temperature soldering paste and a preparation method thereof. The soldering paste is composed of SnBiAgSb-X alloy powder and soldering aiding paste, wherein X is one or more of Ge, In,Co, Ni and P; the weight ratio of the SnBiAgSb-X alloy powder to the soldering aiding paste is (87-90):(10-13); and the soldering aiding paste is prepared from, by mass, 25% to 35% of resin H130, 10%to 20% of resin AX-80, 0.5% to 2% of IRG245 antioxidant, 3% to 5% of BHT antioxidant, 5% to 7% of thixotropic agent, 8% to 13% of activating agent and 30% to 45% of solvent. The soldering paste is applied to electronic product welding, welding temperature can be reduced, welding reliability can be improved, and the problems that black rings exist around welding spots and too much tin sweat existson a bonding pad are effectively solved.

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