The invention provides a high-frequency microwave multi-layer printed circuit blind groove and the manufacturing technique thereof. The blind groove comprises a high-frequency multi-layer printed circuit, a blind groove body, a full-board electro-coppering layer, graphical electro-coppering and a high-frequency signal circuit. The high-frequency multi-layer printed circuit is formed through pressfit of outer layer bottom copper, media, inner layer circuit copper and outer layer bottom copper. The blind groove body is arranged in the high-frequency multi-layer printed circuit. The full-board electro-coppering layer and the graphical electro-coppering are arranged on the blind groove wall of the blind groove body. The media are arranged on the blind groove bottom of the blind groove body. The high-frequency signal circuit is arranged on the outer layer bottom cooper under the blind groove bottom. According to the invention, the difficulty in manufacturing of a copper-containing groove bottom and copper-free groove bottom of the high-frequency multi-layer printed circuit blind groove is solved; an insulation groove which is not connected with current in the copper and tin plating processes is used, so the graphical electro-coppering is protected through the tin layer during etching; the full-board electro-coppering layer of the blind groove bottom is etched, and the media are exposed, so it is achieved that signal are shielded on the blind groove wall and the blind groove bottom is free from interference signals.