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发明公开
CN107870521A 涂敷、显影方法和涂敷、显影装置 审中-实审

涂敷、显影方法和涂敷、显影装置
摘要：
本发明在对形成在基板的正面的含有金属的抗蚀剂膜进行显影时、在基板涂敷含有金属的抗蚀剂而形成抗蚀剂膜且对曝光后的该抗蚀剂膜进行显影时，抑制金属附着到基板的周端面和背面侧周缘部。本发明的涂敷、显影方法包括：在基板(W)的正面涂敷含有金属的抗蚀剂(74)而形成抗蚀剂膜(71)，对该抗蚀剂膜(71)进行曝光的步骤；对上述基板的正面供给显影液(77)而对上述抗蚀剂膜(71)进行显影的显影步骤；和在上述显影步骤前，在没有形成上述抗蚀剂膜的基板(W)的周缘部、至少在周端面和背面侧周缘部形成防止与上述显影液(77)接触的保护膜(72)的步骤。
摘要（英）：

The invention is to provide a technique in which, when a resist film containing a metal formed on a front surface of a substrate is developed, a resist containing a metal is applied to the substrate so as to form a resist film, and when the resist film after it has been exposed is developed, adhesion of the metal to a peripheral end surface of the substrate and a peripheral portion of a rear surface of the substrate can be prevented. A coating and developing method includes: a step that applies a resist 74 containing a metal to a front surface of a substrate W to form a resist film 71, and exposes the resist film; a developing step that supplies a developer 77 to the front surface of the substrate to develop the resist film 71; and a step that forms, before the developing step, a first protective film 72 on a peripheral part of the substrate on which the resist film is not formed, so as to prevent the developer 77 from coming into contact with the peripheral part of the substrate W.

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