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发明公开
CN107946478A 封装结构及其制作方法、封装缺陷检测方法、OLED器件和显示装置 有权

封装结构及其制作方法、封装缺陷检测方法、OLED器件和显示装置
摘要：
本公开提供了封装结构及其制作方法、对所述封装结构进行封装缺陷检测的方法、OLED器件和显示装置。所述封装结构包括：第一盖板和第二盖板；封框胶，用于密封第一盖板和第二盖板之间的空间；吸水检测材料，位于封框胶所密封的空间内；第一电极，该第一电极的一端与吸水检测材料的一部分连接，并且该第一电极的另一端延伸到封框胶所密封的空间之外；以及第二电极，该第二电极的一端与吸水检测材料的另一部分连接，并且该第二电极的另一端延伸到封框胶所密封的空间之外。
摘要（英）：

The invention provides a packaging structure and a manufacturing method thereof, a method for detecting packaging defect on a packaging structure, an OLED device and a display device. The packaging structure comprises a first cover plate and a second cover plate; frame sealing glue for sealing a space between the first cover plate and the second cover plate; a water absorption detection material located in a space sealed by the frame sealing glue; a first electrode, of which one end is connected with a part of the water absorption detection material, and the other end extends out of the spacesealed by the frame sealing glue; a second electrode, of which one end is connected with the other part of the water absorption detection material, and the other end of the second electrode extends out of the space sealed by the frame sealing glue.

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