The invention provides an EVA opening process of an MWT conductive core board. The EVA opening process comprises the steps of pasting a high-temperature adhesive tape within a range near to an electrode point; scrapping bubbles between the adhesive tape and copper foils; respectively holding a corner of a short edge by two workers so that the copper foils are lifted and turned over and are buckledon an opening workbench from a material coming workbench and a back surface of the copper foil faces upwards; lifting the copper foils, laying a high-temperature fabric a part blow the copper foil electrode point so as to separate the two copper foils, turning over one side of the short edge of each copper foil towards the other side when electrode point opening of the copper foils is completed,laying the high-temperature fabric under the electrode point of the next copper foil, and sequentially circulating; pressing an intermediate electrode point for 3-5 seconds by a soldering tip with anelectrode point integral profile tool, and enabling two holes in a middle part of the soldering tip to right opposite to two leading-out points on the copper foils; and lightly stripping EVA at an opening position from the copper foils by tweezers, and tearing off from a disconnection part of each copper foil during EVA stripping. By the EVA opening process, the efficiency is greatly improved, meanwhile, an edge is smooth, and the problem of unsmooth EVA opening is effectively reduced even prevented.