The invention discloses an IC carrier plate outline machining positioning method and equipment adopted in the IC carrier plate outline machining positioning method, and belongs to the technical fieldof IC carrier plate machining. The IC carrier plate outline machining positioning method and the equipment adopted in the IC carrier plate outline machining positioning method aim at achieving the technical purpose of improving outline milling size precision. According to the adopted technical scheme, the IC carrier plate outline machining positioning method comprises the steps that a milling machine table face with an electromagnetic attraction function is used as a tool plate, a pin provided with a base at the lower end is sleeved with a positioning hole of an IC carrier plate to be machinedand placed on the tool plate together, the tool plate fixes the base of the pin through electromagnetic attraction, the IC carrier plate on the pin is taken down, the pin is sleeved with the IC carrier plate again after the base of the pin is sleeved with a base plate, finally, a CCD system is operated to recognize the position of the IC carrier plate, the expansion-shrinkage ratio is automatically calculated according to the graph position for carrying out corresponding compensation on the program, and a milling machine is started to machine the IC carrier plate. The IC carrier plate outlinemachining positioning method and the equipment adopted in the IC carrier plate outline machining positioning method are used for outline machining positioning of other high-end IC carrier plates/PCBs.