The invention discloses a heat dissipation apparatus used for a high heat-flow density chip, and belongs to the heat dissipation and cooling field of a high heat-flow density electronic component. Theheat dissipation apparatus comprises a heat dissipation fan, a micro pump, a heat dissipation heat sink, a temperature sensor and a chip; a liquid injection inlet and a liquid outflux are formed in the heat dissipation heat sink; a liquid backflow inlet and a liquid backflow outlet are formed in the micro pump; the liquid injection inlet is connected with the liquid backflow outlet through a hose; the liquid outflux is connected with the liquid backflow inlet through a hose; the heat dissipation heat sink is fixed on the chip and in contact with the chip to absorb heat generated in operationof the chip; the heat dissipation fan is fixed above the heat dissipation heat sink; an upper contact sheet and a lower contact sheet of the temperature sensor are arranged on the upper surface and the lower surface of the heat dissipation heat sink respectively to obtain the temperature difference of the upper surface and the lower surface of the heat dissipation heat sink; and the chip is connected with the temperature sensor, the heat dissipation fan and the micro pump to transmit different control signals when the heat-flow densities corresponding to different temperature differences are obtained.