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发明公开
CN108400142A 图像传感器半导体封装件及制造半导体器件的方法 审中-实审

图像传感器半导体封装件及制造半导体器件的方法
摘要：
本发明涉及图像传感器半导体封装件及制造具有图像传感器的半导体器件的方法。公开了一种半导体器件，该半导体器件具有第一衬底，在该第一衬底的相对表面之间形成有竖直电互连结构。半导体管芯嵌入在第一衬底内。多个半导体片状器件设置在第一衬底上方或之内。第一半导体片状器件被掺杂为第一导电类型，并且第二半导体片状器件被掺杂为第二导电类型。第二导热衬底设置在半导体片状器件上方且与第一衬底相对。图像传感器设置在第一衬底上方。图像传感器通过第一衬底的竖直电互连结构进行电连接。密封剂沉积在图像传感器上方，密封剂中的开口位于图像传感器的有源区上方。使电流能够流过半导体片状器件以便于图像传感器进行热耗散。
摘要（英）：

The present invention relates to an image sensor semiconductor package and a method of fabricating a semiconductor device having an image sensor. Disclosed is a semiconductor device having a first substrate with a vertical electrical interconnect structure formed between opposing surfaces of the first substrate. A semiconductor die is embedded within the first substrate. A plurality of semiconductor pellets is disposed over or within the first substrate. A first semiconductor pellet is doped to a first conductivity type, and a second semiconductor pellet is doped to a second conductivity type.A second thermally conductive substrate is disposed over the semiconductor pellets opposite the first substrate. An image sensor is disposed over the first substrate. The image sensor is electricallyconnected through the vertical electrical interconnect structure of the first substrate. An encapsulant is deposited over the image sensor with an opening in the encapsulant over an active region ofthe image sensor. An electric current is enabled through the semiconductor pellets for heat dissipation of the image sensor.

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