The invention discloses a thin film residual stress test structure. The thin film residual stress test structure comprises two first supporting columns arranged on a substrate in parallel, a first annular pointer structure arranged between the two first supporting columns in a suspension manner, and two sections of first tested thin films which are arranged on the two sides of a first annular ringin a suspension manner; one end of each first tested thin film is connected with the first supporting column on the corresponding side while the other end is connected with the first annular ring onthe corresponding side; and if each first tested thin film suffers from warping caused by relatively high residual stress, the connected first annular pointer structure is pulled to be deformed, and translation of the first annular pointer structure is caused, so that quantitative change is caused on a displacement measurement structure on the first annular pointer structure, thereby performing quantitative evaluation on the residual stress of the first tested thin film. The invention also discloses a manufacturing method of the thin film residual stress test structure.