The disclosure provides an electronic device. The electronic device includes: a hinge, and a first body and a second body connected by the hinge; wherein the first body comprises: a stamped housing; and a hinge fixing structure on the surface of the housing and including a hinge fixing base that is injection molded on the surface of the housing, wherein the hinge is fixedly connected to the firstbody by the hinge fixing structure. The present disclosure also provides a method of preparing an electronic device.