The invention discloses a laser electrochemical compound micromachining method and device for a semiconductor material, and belongs to the field of special machining. The method comprises the steps that the semiconductor material is heated with laser beams through the characteristic that the electric conductivity of the semiconductor material such as monocrystalline silicon is significantly increased along with increasing of the temperature, the electric conduction property of the material near a machining area is locally enhanced, an electric conduction channel that currents pass preferentially is formed, on this basis, electrolytic machining is introduced in a bias electro-hydraulic beam mode, laser electrochemical self-coupling combined machining near the machining area is achieved, tool setting is not needed, therefore, it is guaranteed that no surface residue adhesion occurs in the laser machining process, the cooling effect can be strengthened, and the purposes of reducing heat damage and residual stress and improving the machining surface quality are achieved. The device comprises a laser, an external light path, an electrolytic power supply and a stable jet flow generatingdevice. The device can generate stable low-voltage electrolytic solution jet flow and achieve impact angle and position adjustment, and it is guaranteed that precise adjustment of the relative positions between the laser beams and the impact jet flow is achieved.