The invention discloses an electronic circuit board lamination layer alignment mechanism comprising a laminating machine body. A motor is installed on the upper end of the internal side surface of thecavity. The rotating shaft of the motor is fixedly connected with first worm rods. The other end of each first worm rod is connected in the cavity through a bearing. The first worm rods are engaged on the surface of first worm gears. Thread cylinders are connected on the surface of first threaded rods through threads. A push plate is fixedly connected on the lower end of the thread cylinders. Supporting columns are fixedly connected on the lower surface of the push plate. Through slots are arranged on the lower end of the internal side of the cavity. The supporting columns are slidably sleeved in the through slots. Rollers are rotatably connected on the lower ends of the supporting columns through rotating shafts. According to the electronic circuit board lamination layer alignment mechanism, positioning is performed through the light emitted by the infrared laser lamp so as to ensure the alignment accuracy between multiple boards and avoid the situation of dislocation of multiple boards.