The invention discloses a solder resisting process for a circuit board. By ingredients and ratio of photosensitive resin, the flexibility of printing ink can be improved obviously, meanwhile, the photosensitive resin has the characteristics of good heat resistance, acid resistance, alkali resistance, solvent resistance and the like, by control over light exposure through an exposure machine, the light exposure can be ensured, inspection is carried out after exposure and development, items of the inspection comprise oil adhesion and hole plugging on the surface of the circuit board, it can be ensured that the produced circuit board meets requirements for circuit boards, segmented baking is two-section baking, it can be ensured that reliability of printing ink can meet the requirement, and the solder resisting process for the circuit board has the advantages that requirements are met, and the service time of the produced circuit board is long, and has wide market prospect.