The invention relates to a new method for preparing reticulated copper foil. The method comprises the steps: adopting 5-20 micron lithium electricity foil, printing a porous pattern on the surface ofthe 5-20 micron lithium electricity foil, and then forming micropores with the diameter being 20-500 microns and the reticulated copper foil with the pore spacing being 50-1000 microns in a mode of special solution corrosion. The method can quickly perforate the copper foil, the edges of micropores are smooth, the surface porosity achieves 10-50%, etched copper can be recycled, the perforating mode is not affected by the copper foil performance, and the process is simple and reliable. The method overcomes the defects that the laser-perforated copper foil is easily burnt and oxidized, copper recovery is poor, and the loss is great. Moreover, the method solves the problems that the mechanically-perforated copper foil has more edge burrs, and the copper foil is easy to break and tear in the perforation process, so that the yield is low.