The invention discloses a device and a process for improving hard coating layer and substrate bonding force through physical vapor deposition; and based on a traditional physical vapor deposition device, the device consists of a columnar arc source or a planar arc source embedded in a cavity wall of a vacuum chamber, a baffle plate positioned in front of the columnar arc source or the planar arc source and capable of adjusting the distance and the position, and a corresponding independent power supply. Through adjustment of potentials among the arc source, the baffle plate, a hanging substratetransfer frame and the wall of the vacuum chamber, the effective control of separation and movement of plasmas emitted by the arc source and ionized working gas ions is realized, the electron bombardment heating, the gas ion or arc source metal ion etching and cleaning and the metal ion injection are realized, and then, the physical vapor deposition of a hard coating layer is followed. The deviceand the process can clean the surface of a substrate more thoroughly, control the surface roughness of the substrate, activate the surface of the substrate, and effectively improve the bonding forcebetween hard protective coating layers on surfaces of such products as cutters, molds, mechanical key parts and locks and basal bodies.