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发明公开
CN109148270A 成膜方法、存储介质和成膜系统 审中-实审

成膜方法、存储介质和成膜系统
摘要：
本发明提供一种在通过规定图案使表面形成有凹凸的基板上形成涂敷膜的成膜方法和成膜系统，该成膜方法是在通过规定图案使表面形成有凹凸的晶片(W)上涂敷抗蚀液，形成抗蚀膜的方法，其包括：在晶片的表面上涂敷涂敷液，形成表面上的抗蚀膜的凹凸的深度(H2)为规定值以下的比抗蚀膜(R)的目标膜厚厚的抗蚀膜(R)即厚膜(R′)的步骤；和除去厚膜(R′)的表面，形成目标膜厚的抗蚀膜(R)的步骤。由此，能够形成膜厚的面内均匀性高的涂敷膜。
摘要（英）：

A film forming method for forming a coating film by applying a coating solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, includes: applying the coating solution onto the surface of the substrate to form a thick film (R') having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the coating film ; and removing the surface of the thick film (R') to form the coating film having the target film thickness.

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