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发明公开
CN109207078A 切割带和切割芯片接合薄膜 无效 - 撤回

切割带和切割芯片接合薄膜
摘要：
提供适于在为了得到带有芯片接合薄膜的半导体芯片而使用切割芯片接合薄膜进行的扩展工序中对切割带上的割断后的带有DAF的半导体芯片抑制从切割带上浮起的同时扩大分离距离，并且适于实现拾取工序中良好的拾取性的切割带和DDAF。对于本发明的切割带(10)，在以拉伸速度1000mm/分钟的拉伸试验(试验片宽度20mm，初始卡盘间距100mm，23℃)中在应变值20％下产生的拉伸应力相对于在以拉伸速度10mm/分钟的拉伸试验(试验片宽度20mm，初始卡盘间距100mm，23℃)中在应变值20％下产生的拉伸应力的比值为1.4以上。本发明的DDAF包含：切割带(10)及其粘合剂层(12)上的DAF(20)。
摘要（英）：

A dicing tape and a DDAF used for suppressing a DAF-equipped semiconductor chip cut off via a dicing tape from floating on the dicing tape while expanding the separation distance and suitable for realizing good pick-up in pick-up processes in an expansion process where a dicing die bonding film is adopted in order to obtain a semiconductor chip with a die bonding film. For the dicing tape (10) ofthe present invention, the ratio between the tensile stress generated at a strain value of 20% in a tensile test at a tensile speed of 1000 mm/min (test piece width 20 mm, initial chuck pitch 100 mm,23 DEG C) and the tensile stress generated at a strain value of 20% in a tensile test at a tensile speed of 10 mm/min (test piece width 20 mm, initial chuck pitch 100 mm, 23 DEG C) is 1.4 or more. TheDDAF of the present invention comprises a dicing tape (10) and a DAF (20) on its adhesive layer (12).

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