The invention discloses a matching method of a chip submodule and a boss and a packaging method of a crimping type IGBT device, in which the chip sub-module is matched with the boss, By grouping the height deviations of the chip submodules, and then the height deviation of the grouped chip submodules and the height deviation of the randomly generated boss to be matched are superposed respectively,The matching deviation value of the whole number of the projections to be matched is calculated, and then compared with the second preset threshold value, and the difference value of the projectionsto be matched is compensated until the matching deviation value of the whole number of the projections to be matched is less than the second preset threshold value, thereby realizing the purpose of one-to-one correspondence between the chip sub-modules and the projections to be matched. The invention can realize the fast matching between the batch chip sub-module and the boss to be matched, namely, the matching efficiency is improved, and the overall matching error is small. The matching mode is favorable for the packaging of the crimping type IGBT device, thereby ensuring that the crimping type IGBT device has good electrical characteristics.