The invention discloses an integrated circuit board via hole external package metal device. The integrated circuit board via hole external package metal device comprises a processing bottom board, wherein copper metal coating is uniformly connected in a conveying rail in a sliding mode; a containing groove is fixedly connected to the top, close to the right side, of the conveying rail; a hydraulicrod is fixedly connected to the interior of the containing groove; the middle position, located on the front surface of the hydraulic rod, of the inner part of the storage groove is fixedly connectedwith a positioning laser emitter; a metal coating discharge port is formed in the bottom, close to the right side, and in the position, symmetrical to the containing groove, of the conveying rail; adrill hole is formed in the integrated circuit board, and the drill hole and the metal coating discharge port are symmetrically arranged; and a driving jacking mechanism is fixedly connected to the position, close to the right side, of the top of the machining bottom plate. The invention relates to the technical field of integrated circuits. By virtue of the integrated circuit board via hole external package metal device, the manual via hole external package precision is improved, and the labor efficiency and the accuracy of workers are improved, so that the firmness of the via hole external package metal is realized; and meanwhile, the purpose of falling and recycling of the whole metal layer is facilitated.