利索-全球专利检索

  1. 登录
  2. 注册
发明公开
CN109545783A 含有三维存储阵列的三维计算芯片 无效 - 撤回

含有三维存储阵列的三维计算芯片
摘要：
本发明提出一种含有三维存储（3D-M）阵列的三维计算（3D-COM）芯片。不同于传统的、计算数据的存储，3D-COM中3D-M阵列主要用于计算参数的存储。一个3D-COM芯片含有成千上万个储算单元，每个储算单元在微尺度下实现3D-M阵列和微计算核之间的三维集成，并实现超大规模平行计算。
摘要（英）：

The invention proposes a three-dimensional computing (3D-COM) chip comprising a three-dimensional memory (3D-M) array. Unlike the traditional storage of computational data, the 3D-M array in the 3D-COM is mainly used for storing memory parameters. One 3D-COM chip comprises thousands of memory and computing units. Each memory and computing unit implements three-dimensional integration between the 3D-M array and a computational core at a microscale, and realizes ultra-large-scale parallel computing.

0/0