The invention provides a circuit board with a stepped pad, and a moulding method thereof. The moulding method of the circuit board with a stepped pad includes the following steps: providing a base material; according to preset conditions, drilling the base material; performing deposition of chemical copper and copper facing on the base material; connecting a preset copper-remaining region of the base material by means of a lead wire, and sticking a dry film to the preset copper-remaining region and the lead wire; etching the base material to enable the preset copper-remaining region to form apad; performing pattern transfer operation on the pad to enable the pad to form a stepped pad structure; and tearing off the lead wire on the base material and the dry film, performing post-process processing on the base material to obtain a circuit board with a stepped pad. The stepped pad structure can increase the function demand while enabling wiring to be dispersed to enable a heat radiationgradient on the circuit board to satisfy the application requirement of the user for multifunction of the circuit board.