The invention provide a substrate processing method capable of removing a processing liquid by supplying a cleaning liquid onto a surface of a substrate securely while suppressing scattering of the cleaning liquid. When performing a liquid processing on a substrate (W) being rotated and removing a processing liquid by a cleaning liquid, in a discharge position moving process, a cleaning liquid nozzle (421) configured to discharge a cleaning liquid slantly with respect to a surface of the substrate (W) toward a downstream side of a rotational direction of the substrate (W) and a gas nozzle (411) configured to discharge a gas toward a position adjacent to a central portion side of the substrate (W) of a liquid arrival position (R) of the cleaning liquid. At this time, the rotation speed of the substrate (W) is varied such that rotation speed in a period during which the liquid arrival position (R) moves in the second region of the peripheral portion side is smaller than a maximum rotation speed in a period during which the liquid arrival position (R) moves in the first region of the central portion side.