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CN109786953A 一种高分子复合微波介质芯片及其应用 无效 - 驳回 转让

  • 专利标题： 一种高分子复合微波介质芯片及其应用
  • 专利标题（英）： High-molecular composite microwave dielectric chip and application thereof
  • 申请号： CN201910060654.6
    申请日： 2019-01-23
  • 公开(公告)号： CN109786953A
    公开(公告)日： 2019-05-21
  • 发明人: 曹丹旦
  • 申请人： 曹丹旦
  • 申请人地址： 江苏省无锡市江阴市澄南二村4幢304室
  • 专利权人： 曹丹旦
  • 当前专利权人： 侯李明
  • 当前专利权人地址： 江苏省无锡市江阴市澄南二村4幢304室
  • 主分类号： H01Q1/38
  • IPC分类号： H01Q1/38 ;  H01Q1/22 ;  C08L23/06 ;  C08L23/12 ;  C08L71/12 ;  C08K3/22 ;  C08K3/36
一种高分子复合微波介质芯片及其应用
摘要：
本发明公开了一种高分子复合微波介质材料及其应用，可应用于微型芯片天线，包括两片金属箔电极以及夹在两片金属箔电极之间的高分子复合微波介质材料层复合构成，高分子复合微波介质材料由包括下列组分及体积百分配比的原料复合而成：有机高分子聚合物40％-65％；无机填料35％-60％；本发明利用高分子复合微波介质材料制备微波介质芯片，利用印制线路板PCB工艺制备微型芯片天线，相对于现有的LTCC工艺路线，具有工艺简单，适合大规模生产，成本低的优点，尤其是克服了陶瓷材料的脆性大易碎裂的缺点；本发明具有加工简单，成本低，适合批量化工业生产。
摘要（英）：

The invention discloses a high-molecular composite microwave dielectric chip and an application thereof. The high-molecular composite microwave dielectric chip can be applied to a tiny chip antenna, and is formed by compounding two metal foil electrodes and a high-molecular composite microwave dielectric material between two metal foil electrodes; the high-molecular composite microwave dielectricmaterial is formed by compounding the following component and raw materials in volume percent proportion: 40%-65% of organic high-molecular polymer and 35%-60% of inorganic filler. The microwave dielectric chip is prepared by utilizing the high-molecular composite microwave material, and the tiny chip antenna is prepared by using a printed circuit board PCB process; compared with the existing LTCCprocess route, the high-molecular composite microwave dielectric material has the advantages of being simple in process, suitable for large-scale production and low in cost; especially, the defect that the ceramic material is large in brittleness and easy to fracture is overcome. The high-molecular composite microwave dielectric chip is simple in processing, low in cost and suitable for batch industrial production.

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