The invention discloses a method for implementing increase of current capacity by a common circuit board in the technical field of battery management. The method comprises the following steps of: S1,selecting a specification copper foil, and windowing on the surface of the copper foil to form a dense net shape; S2, uniformly coating solder paste on each node of the net-shaped copper foil, and carrying out inclined connection to form an inclined solder paste network; S3, carrying out furnace passing processing on the copper foil coated with the solder paste, so that after being molten, the solder paste is shrunk and automatically absorbed on the windowed net-shaped copper foil; and S4, carrying out processing repair on the copper foil subjected to furnace passing processing so as to form solder webbing with a uniform thickness. According to the invention, when the solder paste passes through a furnace, the solder paste is automatically shrunk after being molten and can be absorbed ontothe windowed net-shaped copper foil to form the solder webbing with the uniform thickness, soldering tin is not cut off after being solidified and the soldering tin is large in thickness, so that overcurrent capacity of the copper foil is increased by multiple times; and moreover, according to the method, production steps are not increased, generated benefits are huge, and the defect of excessively low overcurrent capacity of a common copper foil is overcome.