According to one aspect of the present disclosure, a sputter deposition source (100, 200) is provided. The sputter deposition source comprises: an array of electrodes (110) having two or more pairs ofelectrodes, wherein each electrode (112) of the array of electrodes is rotatable around a respective rotation axis (A) and is configured for providing a target material to be deposited on a substrate(10); and a power supply arrangement (120) configured to supply the two or more pairs of electrodes with a bipolar pulsed DC voltage, respectively. According to a further aspect of the present disclosure, a method of depositing a layer on a substrate with a sputter deposition source (100, 200) is provided.