The invention provides a light-emitting device capable of improving the bonding strength between a substrate and a first reflecting member. The device is provided with: a substrate having a base material with an upper surface, a lower surface located on the opposite side of the upper surface, a side surface located between the upper surface and the lower surface, and a recess that opens on the upper surface and the side surface and surrounds the outer periphery of the upper surface, and a first wiring disposed on the upper surface; a first light-emitting element that is electrically connectedto the first wiring and that has a light-emission peak wavelength of 430 nm or more but less than 490 nm, said light-emission peak wavelength being placed on the first wiring; a second light-emittingelement that is electrically connected to the first wiring and has a light emission peak wavelength of 490 nm or more and 570 nm or less, said light emission peak wavelength being placed on the firstwiring; a light guide member covering the first light-emitting element, the second light-emitting element, and the upper surface and separated from the recess; and an annular first reflecting member that is disposed in the recess, surrounds the upper surface and the light guide member, and is in contact with the light guide member. At least a portion of the side surface of the base material is flush with at least a portion of the outer side surface of the first reflecting member.