The invention provides electronic equipment. The electronic equipment comprises a circuit board, a shielding frame and a heat dissipation piece, wherein an electronic heating element is arranged on the circuit board; the shielding frame is arranged on the circuit board and surrounds the side wall surface of the electronic heating element, and an opening is formed in the shielding frame; the heat dissipation piece is arranged above the opening, and the heat dissipation piece is sequentially connected with the electronic heating element through a first elastic heat conduction layer, a first ultra-thin conductive layer and a second elastic heat conduction layer, and the first elastic heat conduction layer and the second elastic heat conduction layer are in a compressed state; the area of thefirst ultra-thin conductive layer is larger than or equal to the area of the opening; the first ultra-thin conductive layer is electrically connected with the shielding frame; and the shielding frame,the first ultra-thin conductive layer and the circuit board form an electromagnetic shielding cavity for accommodating the electronic heating element. According to the electronic equipment provided by the invention, the heat dissipation capability of the electronic heating element can be enhanced while the shielding effect of the electronic heating element is ensured.