The invention relates to a tableting method for a sampler wafer with a boric acid substrate applied to XRFS analysis. The technical scheme of the method comprises the steps of putting 2.5-3.5g boric acid into the bottom of a material cavity of a tableting machine, and spreading out to acquire a substrate layer; preparing a thin film material with the thickness of 0.5-1mm into a wafer with a diameter d that is equal to d0-(3-5mm), and thus acquiring a liner film, wherein d0 is the diameter of the material cavity of the tableting machine, mm; then tiling the liner film on the substrate layer, and uniformly spreading 0.5-3g sample powder onto the liner film; and at last floating the sample powder by using a sample spoon, installing a press head of the tableting machine, pressurizing, keepingthe pressure and demolding to acquire the sampler wafer with the boric acid substrate applied to XRFS analysis. The method has the characteristics of being high in efficiency, not prone to generate astripping layer, small in consumption of sample powder, and high in production rate.