The invention relates to a quad flat no-lead package and a method for cutting the same. The package includes an integrated circuit die, a lead frame, bonding pads, a gold wire, and a package body. Thebonding pads include a non-cuttable bonding pad and a cuttable bonding pad which are electrically connected to each other. The non-cuttable pad is electrically connected to the integrated circuit diethrough the gold wire. The cuttable bonding pad extends from the non-cuttable pad to the outside of the package body. The size of the cuttable bonding pad is increased along the extension direction,so that the cuttable bonding pad can be cut, which meets a user's customized need for integrated circuit chip packages with sensors. A user can cut the integrated circuit chip package into a requiredoutline structure, thereby improving the adaptability of QFN to a terminal. The QFN package board simplifies a manufacturing process, further reduces costs, facilitates transportation and packaging, and makes it easier for the user to customize cutting to obtain an expected QFN.