The invention discloses a photo-thermal dual-curing engineering adhesive, and a preparation method and an application thereof. The photo-thermal dual-curing engineering adhesive is prepared from, by weight, 20-70 parts of a polyurethane acrylate, 10-30 parts of an epoxy polyacrylate, 15-40 parts of isobornyl acrylate, 10-30 parts of cyclic trimethylopropane formal acrylate, 0.2-15 parts of a nanometer inorganic filler, 0.5-3 parts of a photoinitiator, 0.5-3 parts of a thermal initiator and 0.5-5 parts of a photochromic powder. The nanometer inorganic filler is uniformly dispersed in the adhesive, so that the cured adhesive has high hardness, no surface cracks and good mechanical properties; and the photochromic powder in the adhesive can be uniformly fused with the adhesive after being modified, so that the ultraviolet absorption problem of a conventional colored adhesive is solved, and the adhesive is completely cured and has a color indication function. The preparation method of thephoto-thermal dual-curing engineering adhesive has the advantages of simplicity, short production period, and easiness in industrial production.