A resin molding apparatus including a release film feeder configured to feed a release film is provided. The release film feeder includes: a feeding roller around which the release film is wound, a gripper configured to grip an end portion of the release film fed from the feeding roller, a support table configured to support the release film fed by a horizontal movement of the gripper in an X direction, the support table configured to horizontally move at least one of in the X direction or in a Y direction perpendicular to the X direction, the X and Y directions defining a surface parallel toa surface of the support table, and a position detecting sensor on the support table and configured to detect position information of the release film may be provided.