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发明公开
CN110752177A 一种反射式倒装芯片键合机及芯片键合方法 审中-实审

  • 专利标题： 一种反射式倒装芯片键合机及芯片键合方法
  • 专利标题（英）： Reflective flip chip bonding machine and chip bonding method
  • 申请号： CN201910963693.7
    申请日： 2019-10-11
  • 公开(公告)号： CN110752177A
    公开(公告)日： 2020-02-04
  • 发明人: 唐伟杰 , 郑翰 , 储涛
  • 申请人： 浙江大学
  • 申请人地址： 浙江省杭州市西湖区余杭塘路866号
  • 专利权人： 浙江大学
  • 当前专利权人： 浙江大学
  • 当前专利权人地址： 浙江省杭州市西湖区余杭塘路866号
  • 代理机构： 杭州求是专利事务所有限公司
  • 代理商 陈升华
  • 主分类号： H01L21/68
  • IPC分类号： H01L21/68 ;  H01L21/50
一种反射式倒装芯片键合机及芯片键合方法
摘要：
本发明公开了一种反射式倒装芯片键合机及芯片键合方法，能够提升对准以及键合精度，降低了芯片工艺的复杂度。该反射式倒装芯片键合机，包括：用于安装上芯片的上吸附装置；用于安装下芯片的下吸附装置；设置在下吸附装置上的通孔；红外发光二极管；沿红外发光二极管的红外光光路方向设置的分束器；与分束器的出射光连接并正对通孔设置的物镜；与分束器反射光对接的工业相机；与工业相机连接的显示器。本发明观测装置结构简单，无需在两个芯片间插入其他复杂的光学系统来进行观测，大大降低了制造复杂度和成本，并且，大大降低了误差，提高了键合精度。
摘要（英）：

The invention discloses a reflective flip chip bonding machine and a chip bonding method, so that the alignment and bonding precision can be can improved, and the complexity of a chip technology is reduced. The reflective flip chip bonding machine comprises an upper adsorption device for mounting an upper chip, a lower adsorption device for mounting a lower chip, through hole formed in the lower adsorption device, an infrared light-emitting diode, a beam splitter arranged along the infrared light path direction of the infrared light-emitting diode, an objective lens which is connected with theemergent light of the beam splitter and is arranged opposite to the through hole, an industrial camera which is in butt joint with the reflected light of the beam splitter, and a display connected with industrial camera. An observation device is simple in structure, other complex optical systems do not need to be inserted between the two chips for observation, the manufacturing complexity and cost are greatly reduced, moreover, the error is greatly reduced, and the bonding precision is improved.

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