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发明公开
CN111048433A 半导体晶片表面温度监控方法及温度传感器 审中-实审

半导体晶片表面温度监控方法及温度传感器
摘要：
本发明的对晶片表面温度进行实时测量并监控的方法，对研磨垫的表面温度进行实时测量并实时监控，因此可以在清洗工艺中借助于化学反应和摩擦能动地应对晶片表面的不规则的温度变化。本发明的晶片表面温度测量传感器也可以在有从清洗液中产生的烟尘的环境下使用，按照红外线摄像机的各个点分别负责温度，从而能够按照区间校正温度。
摘要（英）：

A method of monitoring the surface temperatures of wafers in real time by measuring them according to the present invention monitors the surface temperatures of a polishing pad in real time by measuring them, and can thus actively deal with irregular variations in temperature on the surface of the wafer attributable to chemical reaction and friction in the process of cleaning the wafer. A sensor for measuring the surface temperatures of a wafer according to the present invention can be used in an environment in which there is fume generated from a cleaning solution, and is responsible for temperatures at respective points of an infrared camera and allows the correction of temperatures in respective sections.

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