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发明公开
CN111212931A 具有空间分离的单个晶片处理环境 审中-实审

具有空间分离的单个晶片处理环境
摘要：
描述了用来处理一或多个晶片的装置及方法。围绕旋转轴用圆形配置布置了多个处理站。具有限定旋转轴的可旋转中心基部、从所述中心基部延伸的至少两个支撑臂、及所述支撑臂中的每个上的加热器的支撑组件被定位为与所述处理站相邻，使得可在各种处理站之间移动所述加热器以执行一或多种处理条件。
摘要（英）：

Apparatus and methods to process one or more wafers are described. A plurality of process stations are arranged in a circular configuration around a rotational axis. A support assembly with a rotatable center base defining a rotational axis, at least two support arms extending from the center base and heaters on each of the support arms is positioned adjacent the processing stations so that the heaters can be moved amongst the various process stations to perform one or more process condition.

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