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发明授权
CN1235337C 电子器件及其制造方法 失效 - 权利终止

电子器件及其制造方法
摘要：
本发明提供一种叠层型电子器件，具有通过介入粘接剂层(3)把元件基板(2)与封装板(5)贴合在一起的结构，在元件基板2上形成露出在叠层体的端面上的端子电极(10)，在封装板(5)的外表面上形成外部电极(12)，端子电极(10)与外部电极(12)通过形成在叠层体的端面上的端面电极(21)构成电连接，该端面的电极(21)的厚度为粘接剂层(3)的厚度的1/2以上、5倍以下。由于通过端面电极使设置在元件基板上的端子电极与设置在叠层体外表面上的外部电极构成可靠的电连接，所以可实现电连接可靠性高的叠层型电子器件。
摘要（英）：

An electronic component includes a laminate having a structure in which an element substrate and a sealing substrate are bonded to each other through an adhesive layer, a terminal electrode is arranged on the element substrate so as to be exposed at an end surface of the laminate, an outside electrode is disposed on the outer surface of the sealing substrate, the terminal electrode and the outside electrode are electrically connected to each other through an end surface electrode disposed on the end surface of the laminate, and the thickness of the end surface electrode is between about one half of the thickness of the adhesive layer and about five times of the thickness thereof.

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