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CN1283409C 脆性材料基片的倒角方法以及倒角装置 失效 - 权利终止

脆性材料基片的倒角方法以及倒角装置
摘要：
形成椭圆形状的第1激光点(LS1)，其一端位于玻璃基片(50)的侧边缘的预定倒角的棱边(51)上。第1激光点(LS1)的长轴相对棱边成为倾斜θ角度的状态，另一端位于棱边(51)的附近部分。第1激光点(LS1)的热能强度，在位于棱边(51)的附近部分的端部小，而在预定倒角的棱边(51)上的端部达到最大。当玻璃基片(50)在X方向移动时，玻璃基片(50)的棱边(51)的附近部分由第1激光点(LS1)预热之后，棱边(51)熔融而倒角。另外，棱边(51)熔融倒角之后，由第2激光点(LS2)加热，通过使基片退火，缓和了残留应力，可以防止微小裂缝的发生。这样，就可以不产生裂缝而可靠地倒角玻璃基片的棱边(51)。
摘要（英）：

A first laser spot (LS1) in elliptic shape having one end positioned on an edge (51) to be chamfered included in the side edges of a glass substrate (50). The major axis of the first laser spot (LS1) is inclined by an angle &thetas; with respect to the edge, and the other end is positioned on the portion in vicinity of the edge (51). The heat energy intensity of the first laser spot (LS1) is low at the end positioned on the portion in the vicinity of the edge (51) and highest at the end positioned on the edge (51) to be chamfered. When the glass substrate (50) is moved in the X−direction, the first laser spot (LS1), after preheating the portion of the glass substrate (50) in the vicinity of the edge (51), melts and chamfers the edge (51). Further, after the edge (51) has been melted and chamfered, the substrate is heated by a second laser spot and then annealed, thereby making it possible to mitigate the residual stress and prevent the occurrence of fine cracks. Thereby, the edge (51) of the glass substrate can be reliably chamfered without producing cracks.

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