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发明公开
CN1371529A 化学机械研磨用研磨剂及研磨方法 失效 - 权利终止

化学机械研磨用研磨剂及研磨方法
摘要：
本发明中提供了一种含有氧化剂、氧化金属溶解剂、保护膜形成剂、水溶性聚合物和水的CMP用研磨剂,及用它的研磨方法。水溶性聚合物的重量平均分子量在500以上,研磨剂的动摩擦系数在0.25以上,研磨剂的厄布洛德粘度在0.95cP以上,1.5cP以下,研磨剂的拐点压力在50gf/cm2以上。
摘要（英）：

This invention provides a polishing medium for CMP, comprising an oxidizing agent, a metal-oxide-dissolving agent, a protective-film-forming agent, a water-soluble polymer, and water, and a polishing method making use of this polishing medium. Also, it is preferable that the water-soluble polymer has a weight-average molecular weight of 500 or more and the polishing medium has a coefficient of kinetic friction of 0.25 or more, a Ubbelode's viscosity of from 0.95 cP to 1.5 cP and a point-of-inflection pressure of 50 gf/cm<2>.

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