A circuit device for interconnecting first and second multilayer circuit boards is described herein. The first multilayer circuit board may include a first plurality of electrically conductive vias ofvarying depths and the second multilayer circuit board may include a second plurality of electrically conductive vias. The circuit device comprises a first plurality of pins located on a first side ofthe circuit device corresponding to the first plurality of electrically conductive vias of the first multilayer circuit board, each pin having a length compatible with a depth of a respective one oft he first plurality of electrically conductive vias of the first multilayer circuit board. The circuit device further comprises a second plurality of pins located on a second side of the circuit devicecorresponding to the second plurality of electrically conductive vias of the second multilayer circuit board.