Laser processing method comprises using a CO2 laser as laser light source which produces a pulsed laser light having a repeating frequency of more than 50 kHz, a pulse length of shorter than 200 ns. The laser beam (4) is deviated onto the substrate (6) to be processed using a deviating unit (2). Preferred Features: The laser beam has a wavelength of 9.2 +/- 0.2 microns. The laser pulse has an energy of 0.7 mJ. The laser beam is focussed on the substrate with a diameter of 50-200 microns. The material to be processed is an epoxy resin.