The carrier ( 30 ) comprises a first etch mask ( 14 ), a first metal layer ( 11 ), an intermediate layer ( 12 ), a second metal layer ( 13 ) and a second etch mask ( 17 ). Both the first and the second etch mask ( 14, 17 ) can be provided in one step by means of electrochemical plating. After the first metal layer ( 11 ) and the intermediate layer ( 12 ) have been patterned through the first etch mask ( 14 ), an electric element ( 20 ) can be suitably attached to the carrier ( 30 ) using conductive means. In this patterning operation, the intermediate layer ( 12 ) is etched further so as to create underetching below the first metal layer ( 11 ). After the provision of an encapsulation ( 40 ), the second metal layer ( 13 ) is patterned through the second etch mask ( 17 ). In this manner, a solderable device ( 10 ) is obtained without a photolithographic step during the assembly process.