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发明公开
CN1925153A 发光二极管芯片合晶技术 无效 - 撤回

发光二极管芯片合晶技术
摘要：
本发明提供一种发光二极管芯片合晶技术，以小尺寸芯片，肩并肩拼合成多芯片大面积，芯片与芯片之间隙较适合者大约4mil以下，并结合基板(substrate)之特殊散热结构以发散产生之热能，其特征是：可视为单一光源，能适当除去大尺寸芯片之全反射散失光强度及减少内部吸收产生热能之机会，并进而取代大尺寸芯片达到高亮度、高功率之效果。
摘要（英）：

This invention provides one light diode chip integration technique with small size chip to integrate large area of chips, wherein, chips distance is about 4mil and integrates substrates special dissipation structure to dissipate heat energy. The invention is characterized by single light source to remove large size of chip total reflection to reduce inner absorptive heat energy.

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