The invention provides a pressure-sensitive adhesive that is used in processing an article such as a semiconductor wafer, the pressure-sensitive adhesive sheet is one that has a base, an intermediate layer and a pressure-sensitive adhesive layer in order, wherein the intermediate layer has an elastic modulus at elongation at 23 DEG C of 1 MPa or more and 100 MPa or less, the intermediate layer includes an acrylic polymer obtained by polymerization of a (meth) acrylic monomer mixture containing 1% by weight or more and 20% by weight or less of a nitrogen-containing acrylic monomer, the acrylicpolymer containing 20% by weight or less of a polymer component having a molecular weight of 100,000 or less, and the base includes at least one film having an elastic modulus at in tension at 23 DEGC of 0.6 GPa or more.