The utility model relates to an internal lead structure of a semiconductor device, which comprises an internal lead for electrically connecting a lead frame with a chip loaded in the lead frame, and is characterized in that a bridge structure is welded on the surface of the chip corresponding to the joint of the internal lead, and the bridge structure is a metal medium, particularly a gold pellet or a gold alloy pellet. The internal structure of the semiconductor device enables the internal lead to be electrically connected with the chip through the bridge structure, thereby completely solving the technical disadvantage of totally using other metal materials, such as copper, as the internal lead, improving production efficiency and the reliability of products, and meanwhile greatly saving cost compared with the internal lead of the semiconductor device made of gold thread.