The utility model discloses a winding displacement sensing device for cutting silicon wafers. Two sensor bars matching with each other are arranged on a sensor bar support in a staggered manner, the horizontal plane with connected ends of the sensor bars are higher than the horizontal plane with extending ends of the sensor bars, the projections of the two sensor bars on the horizontal planes are parallel to each together, and a gap matching with a steel wire is formed between the two sensor bars. During operation, by the aid of the sensor bars with inclined structures, slurry and silicon powder which are attached to the sensor bars and the sensor bar support can flow away along the outer surfaces of the sensor bars and fall to the outside of the winding displacement sensing device, accordingly, the slurry and the silicon powder are effectively prevented from accumulating on the sensor bars and the sensor bar support, sensitivity of the sensor bars is prevented from decreasing due to accumulation of materials and can keep stable, and requirements of normal operation of the winding displacement sensing device are met.