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实用新型
CN204424217U 一种金属电极制造装置 有权

一种金属电极制造装置
摘要：
本实用新型提出了一种金属电极制造装置，装置包括由下至上依次设置的载片台(1)、盖板(4)和固定件(5)，载片台(1)中心设有方形孔，金属掩膜罩(2)跨放在所述方形孔上；位于金属掩膜罩(2)上方的所述盖板(4)纵剖面为延长的倒置凹槽，其两端的凸块支撑在载片件上；硅片上设有芯片，芯片的发射极为厚金属电极，金属掩膜罩(2)依据芯片的发射极的形状制备。该金属电极制造装置，金属通过金属掩膜罩的窗口到达硅片表面，在指定的区域淀积形成厚金属电极，减少了一次光刻和一次金属刻蚀工艺，缩短了加工周期，降低了生成成本。
摘要（英）：

The utility model discloses a metallic electrode manufacture apparatus which comprises, from top to bottom arranged, a slide holder (1), a cover plate (4) and fixing member (5), wherein a square hole is arranged in the center of the slide holder (1), a metallic mask cover (2) crosses over the square hole, the profile of the cover plate (4) above the metallic mask cover (2) is a prolonged inverted groove, and two ends of the cover plate (4) are supported on a carrier sheet. A chip is arranged on a silicon chip, the emitter electrode of the chip is a thick metallic electrode, and the metallic mask cover (2) is prepared according to the shape of the emitter electrode of the chip. Metal can reach the surface of the silicon chip through the window of the metallic mask cover (2) to deposit thick metallic electrode in a predetermined area. One time lithographic and one time metallic etching process are eliminated, the processing period is shortened, and the production cost is reduced.

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